Commits
Merge branch 'stmmac-platform-glue' Joachim Eastwood says: ==================== convert stmmac glue layers into platform drivers This patch set aims to convert the current dwmac glue layers into proper platform drivers as request by Arnd[1]. These changes start from patch 3 and onwards. Overview: Platform driver functions like probe and remove are exported from the stmmac platform and then used in subsequent glue later conversions. The conversion involes adding the platform driver boiler plate code and adding it to the build system. The last patch removes the driver from the stmmac platform code thus making it into a library for common platform driver functions. The two first patches adds glue layer for my platform. I chose to first add old style glue layer and then convert it. The churn this creates is just 3 lines. I would be very nice if people could test this patch set on their respective platform. My testing has been limited to compiling and testing on my (LPC18xx) platform. Thanks! Next I will look into cleaning up the stmmac platform code. [1] http://marc.info/?l=linux-arm-kernel&m=143059524606459&w=2 ==================== Tested-by: Chen-Yu Tsai <wens@csie.org> Tested-by: Dinh Nguyen <dinguyen@opensource.altera.com> Signed-off-by: David S. Miller <davem@davemloft.net>
