Merge branch 'platform-ti-linux-4.19.y' of git://git.ti.com/~rrnayak/ti-linux-kernel/platform-linux-feature-tree into hwspinlock-linux-4.19.y
Pull in the platform base tree into the hwspinlock feature tree. The
merge pulls in the necessary board support for all the AM65x boards.
All the other boards are already supported on vanilla 4.19 kernel.
It also pulls in the defconfig_builder infrastructure used by TI
Integration kernels. This allows the required IPC driver support to
be added on the TI K3 family of SoCs.
* 'platform-ti-linux-4.19.y' of git://git.ti.com/~rrnayak/ti-linux-kernel/platform-linux-feature-tree: (123 commits)
dmaengine: ti: k3-udma: Try to use the highest TPL channels for MEM_TO_MEM
dmaengine: ti: k3-udma: Only allow MEM_TO_MEM transfer on the main UDMA
ti_config_fragments/defconfig_map.txt: add missing baseport.cfg entries
ti_config_fragments: v8_baseport: Forward port v8_baseport cfg from 4.14
arm64: dts: ti: k3-am6: Add NAVSS and PDMA nodes
dmaengine: ti: k3-udma: Add glue layer for non DMAengine users
dmaengine: ti: New driver for K3 UDMA
dmaengine: ti: Add cppi5 header for UDMA
dt-bindings: dma: ti: Add document for K3 UDMA
dmaengine: Add function to request slave channel from a dma_device
dmaengine: Add support for reporting DMA cached data amount
dmaengine: Add metadata_ops for dma_async_tx_descriptor
dmaengine: doc: Add sections for per descriptor metadata support
soc: ti: k3: add navss ringacc driver
bindings: soc: ti: add documentation for k3 ringacc
firmware: ti_sci: Add resource management APIs for ringacc, psi-l and udma
ti_config_fragments: v8_baseport: enable K3 thermal
arm64: dts: ti: am6: Add VTM node
arm64: dts: ti: am654: Add thermal zones
thermal: k3: Add support for bandgap sensors
...
Signed-off-by: Suman Anna <s-anna@ti.com>
